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June 2014

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Subject:
From:
Victor Hernandez <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 2 Jun 2014 10:05:31 -0500
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Would XRF plating alloy identification work here on a loose part?

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman
Sent: Monday, June 02, 2014 9:36 AM
To: [log in to unmask]
Subject: Re: [TN] Capacitor - strange soldering behavior

Hi Gil - two questions: (1) Does the capacitor have a barrier layer of copper or nickel to prevent the underlying metallization from leaching into the solder joint?; (2) Have you completed a cross section to assess the solder joint microstructure?

Dave Hillman
Rockwell Collins
[log in to unmask]


On Thu, May 29, 2014 at 9:01 AM, Zilber Gil wrote:

> Hello Technet,
>
> While soldering this ceramic capacitor (
> http://ipc-technet.groupsite.com/gallery/27235), its looks like that
> the capacitor suck the solder from the PCB`s pad to the capacitor pad
> and the color is now grayish and porosity. XRF found Sn, Pb, Cu on the
> capacitor pad. PCB Solderability was good and the profile was SnPb at
> 225 deg C under Nitrogen. Other capacitors and components on the board
> look normal with shine soldering.
> Can anybody seen something like that before? Any ideas?
>
> Thanks and have a wonderful weekend.
>
> Dr. Gil Zilber
> Technologist, Elta system Ltd.
>
>
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> Thank you.
>
>
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