Hello Gil,
I have seen similar condition on a thermistor soldered on ENIG PCB using
SAC405.
It was the only component that had all the solder attached on the
metallization and not on the pad surface that showed the dewetting
condition.
The analyses performed at that time, identified that component finishing
were Pd-Ag-Pt (Palladium - Silver - Platinum).
At that time the problem was solved by the Component Supplier changing
this component with another having another finishing.
Hope this can help in understanding your problem.
Regards.
Francesco
Francesco Di Maio
IPC e Formazione
IPC A-600, IPC A-610, IPC 7711/21 Certified IPC Trainer
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Zilber Gil <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
03/06/2014 21.21
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[TN] השב: [TN] Capacitor - strange soldering behavior
Yes they pass but after the test the surface is grey and poros.
Thanks,
Gil
-------- הודעה מקורית --------
מאת: [log in to unmask]
תאריך:03/06/2014 2:20 PM (GMT+02:00)
אל: [log in to unmask],Zilber Gil
עותק: [log in to unmask]
נושא: RE: [TN] Capacitor - strange soldering behavior
Do the ceramic caps pass Solderability by themselves?
Victor,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Zilber Gil
Sent: Monday, June 02, 2014 4:37 PM
To: [log in to unmask]
Subject: [TN] השב: [TN] Capacitor - strange soldering behavior
This Ceramic Cap is from different company. Looks good before soldering.
Thanks,
Gil
-------- הודעה מקורית --------
מאת: Reuven Rokah
תאריך:02/06/2014 10:31 PM (GMT+02:00)
אל: [log in to unmask]
נושא: Re: [TN] Capacitor - strange soldering behavior
Hi Gil,
It seems a component plating failure.
Try to check what is the difference between this capacitor and other one
with good performance.
It seems your problematic cap. have grainy structure plating which that
suck the solder during the solder joint.
Try to work with 220 deg C.
On Mon, Jun 2, 2014 at 6:12 PM, Zilber Gil wrote:
> XRF was done on a new part before reflow. Before reflow the surface
> was shine. After reflow it was grayed and porous as seen in the picture.
> Thanks,
>
> Gil
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
> Sent: Monday, June 02, 2014 6:06 PM
> To: [log in to unmask]
> Subject: Re: [TN] Capacitor - strange soldering behavior
>
> Would XRF plating alloy identification work here on a loose part?
>
> Victor,
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman
> Sent: Monday, June 02, 2014 9:36 AM
> To: [log in to unmask]
> Subject: Re: [TN] Capacitor - strange soldering behavior
>
> Hi Gil - two questions: (1) Does the capacitor have a barrier layer of
> copper or nickel to prevent the underlying metallization from leaching
> into the solder joint?; (2) Have you completed a cross section to
> assess the solder joint microstructure?
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
> On Thu, May 29, 2014 at 9:01 AM, Zilber Gil wrote:
>
> > Hello Technet,
> >
> > While soldering this ceramic capacitor (
> > http://ipc-technet.groupsite.com/gallery/27235), its looks like that
> > the capacitor suck the solder from the PCB`s pad to the capacitor
> > pad and the color is now grayish and porosity. XRF found Sn, Pb, Cu
> > on the capacitor pad. PCB Solderability was good and the profile was
> > SnPb at
> > 225 deg C under Nitrogen. Other capacitors and components on the
> > board look normal with shine soldering.
> > Can anybody seen something like that before? Any ideas?
> >
> > Thanks and have a wonderful weekend.
> >
> > Dr. Gil Zilber
> > Technologist, Elta system Ltd.
> >
> >
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