Hi Gil - two questions: (1) Does the capacitor have a barrier layer of
copper or nickel to prevent the underlying metallization from leaching into
the solder joint?; (2) Have you completed a cross section to assess the
solder joint microstructure?

Dave Hillman
Rockwell Collins
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On Thu, May 29, 2014 at 9:01 AM, Zilber Gil <[log in to unmask]> wrote:

> Hello Technet,
>
> While soldering this ceramic capacitor (
> http://ipc-technet.groupsite.com/gallery/27235), its looks like that the
> capacitor suck the solder from the PCB`s pad to the capacitor pad and the
> color is now grayish and porosity. XRF found Sn, Pb, Cu on the capacitor
> pad. PCB solderability was good and the profile was SnPb at 225 deg C under
> Nitrogen. Other capacitors and components on the board look normal with
> shine soldering.
> Can anybody seen something like that before? Any ideas?
>
> Thanks and have a wonderful weekend.
>
> Dr. Gil Zilber
> Technologist, Elta system Ltd.
>
>
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