Hi John - PTH hole is one of the topics that goes along with politics and
taxes! The IPC JSTD 001 has discussed/debated the topic for years. I
recommend you contact Jack Crawford at IPC to get a copy of the report
submitted to the committee for Class 2 PTH fill by HP. I know its not
exactly what you are looking for but it will be useful. I don't know of any
detailed published studies on Class 3 PTH fill - the 001 committee has
asked but minimal data has been submitted. I know of at least one study on
Class 3 PTH fill reliability that is in progress but it has another 8
months of thermal cycle conditioning to complete so its not going to be of
use right now. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]


On Thu, Jun 26, 2014 at 3:00 PM, Nieznanski, John A - Exelis <
[log in to unmask]> wrote:

> Good Afternoon TechNet!
>
> Can anyone point me to any published reliability analysis or life test
> results of "partially filled" PTH (plated through hole) vias?  I'm calling
> these partially filled if they do not meet minimum J-STD-001 standards for
> class 3 product (vertical fill of solder at least 75% of PWB thickness).
> The applicable J-STD-001 figure is shown as Fig 6-3. There is a note that
> says the 25% unfilled height includes the sum from both sides.
>
> Thank you for all your help!
>
>
> John Nieznanski
>
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