This might help:

Happy Holden, "Reliability of Partially Filled SAC 305 Through-Hole
Joints," IPC Apex, February 2009.


Best,

Mike

Mike Buetow
PCD&F/Circuits Assembly
w/m: 617-327-4702
@mikebuetow

The 2014 CIRCUITS ASSEMBLY Directory of EMS Companies:
circuitsassembly.com/dems

PCB West: Silicon Valley's largest printed circuit trade show! Sept. 9-11,
2014 / pcbwest.com




-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Nieznanski, John A -
Exelis
Sent: Thursday, June 26, 2014 4:00 PM
To: [log in to unmask]
Subject: [TN] reliability of partially filled PTH vias

Good Afternoon TechNet!

Can anyone point me to any published reliability analysis or life test
results of "partially filled" PTH (plated through hole) vias?  I'm calling
these partially filled if they do not meet minimum J-STD-001 standards for
class 3 product (vertical fill of solder at least 75% of PWB thickness).
The applicable J-STD-001 figure is shown as Fig 6-3. There is a note that
says the 25% unfilled height includes the sum from both sides.

Thank you for all your help!


John Nieznanski

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