Good Afternoon TechNet!

Can anyone point me to any published reliability analysis or life test results of "partially filled" PTH (plated through hole) vias?  I'm calling these partially filled if they do not meet minimum J-STD-001 standards for class 3 product (vertical fill of solder at least 75% of PWB thickness). The applicable J-STD-001 figure is shown as Fig 6-3. There is a note that says the 25% unfilled height includes the sum from both sides.

Thank you for all your help!


John Nieznanski

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