Thanks all for the replies.
I intentionally left out details, but many hit the nail(s) on the head, yet didn't provide the answer I was looking for.
Ahne recommended LPKF. This was done at their facility, but we gave them production rates to meet/exceed. This was the best they could do to make the equipment cost justifiable. This coincides with Dave's recommendation to change parameters. We need a specific throughput to hit "break even" on this rather large investment.
Brien suggested the Hepco 1200-1. We are currently using a similar system by FKN with good success. Throughput is great (4X faster than "goal" for laser) and yield IMHO, is fine, i.e., <20 PPM DPMO. Unfortunately, those 20 defects are each on different boards (13 opportunities) with cost exceeding $500 each. Usual failure is delamination beyond acceptable limits, another discussion for another time, perhaps.
Graham, you suggested CC after routing, which was my first preference, but that really disrupts the work flow as after routing, it would need cleaning (dust FOD), drying (oven? Low profile device entrapments) and then would not be conducive to our current CC "tooling" which would need to be rebuilt.
Here's what I was really asking: Is there some way around the IPC spec cited, as this "technically" isn't the "charred or burned solder mask" as shown in the illustration. I do not believe the charring is anything more than cosmetic and will not affect form, fit function or reliability.
Ed Popielarski
Engineering Manager
970 NE 21st Ct.
Oak Harbor, Wa. 98277
Ph: 360-675-1322
Fx: 206-624-0695
Cl: 949-581-6601
"It's one kind of victory to slay a beast, move a mountain, and cross a chasm, but it's another kind altogether to realize that the beast, the mountain, and the chasm were of your own design."
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-----Original Message-----
From: Graham Collins [mailto:[log in to unmask]]
Sent: Wednesday, June 18, 2014 5:56 AM
To: TechNet E-Mail Forum; Ed Popielarski
Subject: Re: [TN] Laser depanelization
Depanel before coating and (if needed) use a carrying fixture? Anything I've ever built that went into an airplane was depanelized before coating.
regards,
Graham Collins
Senior Process Engineer
Sunsel Systems
(902) 444-7867 ext 211
On 6/17/2014 7:41 PM, Ed Popielarski wrote:
> Hi all,
>
> One of our aerospace customers is requesting boards depanelized from support frames.
>
> I looked into router, but the conformal coating tends to smear and will be a significant FOD issue later.
>
> We are willing to invest in laser, however, the result is a bit of charring on the edge, not much of a surprise. Unfortunately, this example http://stevezeva.homestead.com/Capture.JPG was rejected on IPC-A-610-Rev E Para. 10.7.4 "Solder Mask Coating-Discoloration" "Burned or charred solder mask material.
>
> In my opinion, this is not within the "spirit of the law" since there are no specific provisions for laser depanelization, only marking.
>
> Anyone know of some way around this?
>
> Ed Popielarski
> Engineering Manager
>
> [cid:[log in to unmask]]
> 970 NE 21st Ct.
> Oak Harbor, Wa. 98277
>
> Ph: 360-675-1322
> Fx: 206-624-0695
> Cl: 949-581-6601
>
> "It's one kind of victory to slay a beast, move a mountain, and cross a chasm, but it's another kind altogether to realize that the beast, the mountain, and the chasm were of your own design."
> https://maps.google.com/maps/myplaces?hl=en&ll=48.315753,-122.643578&s
> pn=0.011188,0.033023&ctz=420&t=m&z=16&iwloc=A
>
>
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