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June 2014

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Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Hillman <[log in to unmask]>
Date:
Mon, 16 Jun 2014 11:37:27 -0500
Content-Type:
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Do you have any pictures? I would make diagnosis/recommendations more
accurate.

Dave Hillman
Rockwell Collins
[log in to unmask]


On Mon, Jun 16, 2014 at 11:22 AM, Vladimir Igoshev <
[log in to unmask]> wrote:

> Hi Paul,
>
> ‎It can be contamination if the balls or another reasons. We can figure it
> out, so please let me know if you decide to do root cause analysis.
>
> Regards,
>
> Vladimir Igoshev
> SENTEC Testing Laboratory Inc.
> 11 Canadian Road, Unit 7
> Scarborough, ON M1R 5G1
> Phone: 647-495-8727
> Cell: 416-899-1882
> [log in to unmask]
> www.sentec.ca
>   Original Message
> From: Paul Taylor
> Sent: Monday, June 16, 2014 12:03 PM
> To: [log in to unmask]
> Reply To: TechNet E-Mail Forum
> Subject: [TN] Soldering Issues on Freescale PGA357
>
> Hi
>
> new to the forum, although in a previous life I used it quite a lot!
>
> We use the Freescale MPC860DTCZQ50D4 in one of our designs, we've had a
> few issues with soldering at our sub-contractor which has got worse as we
> just don't seem to be able to lock down the root cause.
> We have other BGA's on the boards (different pitches) which solder ok
>
> The problem is always the outer pins in the corners , I've a lot of infor
> on the tests we have done, but I had seem a post about contamination of the
> balls on the Motorola package, which to be frank I hadn't considered
>
> I've also seen some info about substrate changes which I'm wondering if it
> also was connected
>
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