Hi Paul,

‎It can be contamination if the balls or another reasons. We can figure it out, so please let me know if you decide to do root cause analysis.

Regards,

Vladimir Igoshev
SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7
Scarborough, ON M1R 5G1
Phone: 647-495-8727
Cell: 416-899-1882
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www.sentec.ca
  Original Message  
From: Paul Taylor
Sent: Monday, June 16, 2014 12:03 PM
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: [TN] Soldering Issues on Freescale PGA357

Hi 

new to the forum, although in a previous life I used it quite a lot!

We use the Freescale MPC860DTCZQ50D4 in one of our designs, we've had a few issues with soldering at our sub-contractor which has got worse as we just don't seem to be able to lock down the root cause.
We have other BGA's on the boards (different pitches) which solder ok

The problem is always the outer pins in the corners , I've a lot of infor on the tests we have done, but I had seem a post about contamination of the balls on the Motorola package, which to be frank I hadn't considered

I've also seen some info about substrate changes which I'm wondering if it also was connected

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