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May 2014

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Subject:
From:
"Gumpert, Ben" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gumpert, Ben
Date:
Fri, 30 May 2014 11:32:42 +0000
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Juliano,

The temperature you need is 40°C if you want to leave the parts in the tape and reel (this lower temperature prevents damage to the reel or to the cover tape) but this will take a long time. If you want to remove the parts from the tape then you can bake for a shorter period at a higher temperature, but then you have to deal with loose parts or find a tray to put the parts in.

The time for the bake process depends on the size and thickness of the part. All of the information is in table 4-1 of the J-STD-033, but be sure to look at the bottom of the table, which talks to BGAs larger than 17 mm square.

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Datacom - Juliano Ribeiro
Sent: Friday, May 30, 2014 7:25 AM
To: [log in to unmask]
Subject: EXTERNAL: [TN] Baking in the Tape and Reel

Dears,

We need baking in the BGA, but the component is in Tape and Reel.

What are time and temperature to the baking? Is there information in the JedeC-033/020?

 

Thank you a lot

_____________________________

Juliano Bettim Ribeiro

DATACOM 

ENGENHARIA DE PROCESSOS
Rua América Nº 1000 - Eldorado do Sul - RS CEP: 92990-000 
+55 (51) 8446-2135

+55 (51) 3933-3000 

Ramal: 3877
 <mailto:[log in to unmask]> [log in to unmask] 
 <http://www.datacom.ind.br/> www.datacom.ind.br

 


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