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May 2014

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Subject:
From:
"Glidden, Kevin" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Glidden, Kevin
Date:
Fri, 16 May 2014 15:37:20 +0000
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Hello all,

When ordering foils per IPC-4562, there is an option for specifying "Bond Enhancement Treatment", and one can specify letter codes for:

N = No treatment, no stain proofing
P = No treatment, stain proofing both sides
S  = Single Side bonding enhancement treatment (matte side), stain proofing both sides
D = Double Sided bond enhancement treatment, staing proofing both sides
R = Reverse-treated bond enhancement (cathode side), stain proofing both sides.

Can anyone explain what the "treatment" and "stain proofing" consists of?  How does the bond enhancement treatment enhance the bond?  I assume the implied "bond" is to epoxy in the PCB stack.   Would either of these treatments effect solder wetting?

Thanks.

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