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May 2014

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Subject:
From:
Julie Silk <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Julie Silk <[log in to unmask]>
Date:
Thu, 15 May 2014 14:18:29 -0500
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The mechanical properties of gold-tin intermetallic were determined using nanoindentation.  The conclusion drawn is that the early fracture is caused by the _difference_ in hardness between the AuSn4 and Sn or Cu6Sn4 -- more so than the brittleness of the AuSn4 itself.  I've seen both fracture at the interface and through the IMC.  I'd like thoughts from this group.

The sample is of a platen with excessive Au, with Ni underplate, soldered to a Sn-plated platen with no Ni underplate, aged for 1000 hours at 120C.  It's from a project at CALCE that I sponsored (studying gold content in SAC -- we're doing papers on this for SMTA).

The analysis is in the e-seminar at the link below.  It starts with explaining how to analyze material characteristics, how to get the constants for the constitutive equations from nanoindentation and then goes into the results from the gold-SAC solder joint.  It's part of an excellent seminar series called Nanoindenter University.  This one is on solder joint analysis and seemed like the metallurgists among you would find it especially interesting.  Personally, I found it interesting also, but probably need to watch a couple more times before I understand half of it.    I apologize upfront:  you have to give your contact information, so it takes a while to get in and you might get followup emails.  

Link
https://agilenteseminar.webex.com/agilenteseminar/lsr.php?RCID=213a72aefd3e4970b5e60208e8dad31b 

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