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May 2014

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Subject:
From:
Ahne Oosterhof <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ahne Oosterhof <[log in to unmask]>
Date:
Mon, 5 May 2014 09:57:43 -0700
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That is 'correct'.

Ahne.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Wayne Thayer
Sent: 5 May, 2014 05:15
To: [log in to unmask]
Subject: Re: [TN] Solder Mask over Tin Lead Plating

This was common practice in the days before SMT.  The masks used at the time would ripple where the tracks were reflowed, but didn't crack.  Still made it through the solder wave just fine, and no problem with hand soldering either. 
I sometimes still see this today with single sided wave soldered boards such as cheap consumer audio and power supplies.

"Correct" is what works for your application.  Inherently, there is no reliability issue with this construct.

Wayne Thayer

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ramakrishnan Saravanan
Sent: Sunday, May 04, 2014 4:18 AM
To: [log in to unmask]
Subject: [TN] Solder Mask over Tin Lead Plating

Hi,

We received few PCBs from an European PCB manufacturer for Aerospace Industry. 
I am surprised to see Solder Mask is applied over tin lead plated tracks. My understanding is if u do reflow , the solder under the mask will melt and affect the mask. The correct method is applying Soldermask over bare copper isn't?. Kindly advise. regards,

R.Saravanan

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