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May 2014

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From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Mon, 5 May 2014 16:14:51 +0000
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It is not that formidable. There are many good classes out there from solder training specialists who perform this training, and do it very well.
A bigger issue is to make sure the PWB surface finish is selected that will facilitate BGA assembly, and establishing a relationship with a board fabricator who knows how to plate ENIG, Enepig, and IAg repeatably and reliably. THAT is the key to a good BGA process. Placement, reflow, and even rework are pretty straightforward.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of <Bruce Tostevin>
Sent: Monday, May 05, 2014 11:03 AM
To: [log in to unmask]
Subject: Re: [TN] Production with BGA's

Jim,

Are you going to do your own BGA rework or have it done elsewhere?  Reworking BGAs is just as formidable an undertaking as assembling with them, sometimes even moreso.  Evaluating, acquiring and installing the proper equipment, accessories, microstencils, nozzles, training operators and developing the expertise to do it properly are all critical elements of that skillset.  

No matter how good your assembly practices are, you will soon be faced with removing and replacing BGAs for any of a dozen different reasons (bridges, opens, misregistration, test & debug support, ECOs, etc.). 

Bruce Tostevin
Benchmark Electronics
Nashua, New Hampshire

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jim West
Sent: 5 mai 2014 10:26
To: [log in to unmask]
Subject: [TN] Production with BGA's

Hi everyone,

A happy Monday to you all!

How many of you have experience with BGA's?  We are looking at possibly having new designs that require BGA's.  I have never ran, nor has my currently company, ran a process with BGA's and I'm trying to get my hands around everything needed to be successful.  I believe my biggest concern will be the soldering process (material and process) and inspection afterwards.  I feel pretty confident my paste printer, pick and place and reflow process will be capable of handling the BGA process based on feedback from the equipment manufacturers for those machines.  I know this is a very broad question, but what do you guys think my focus should be on based on your experience?  I have some time to prepare, so any feedback will be greatly appreciated.   One specific question I do have is, will I need 100% X-Ray inspection?

Thanks,
Jim


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