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Date: | Mon, 5 May 2014 15:31:23 +0000 |
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Hi ,
I may be out of scope but since this is new to your team I would advise you to also verify with your design team that they have followed the manufacturers recommended footprints of the BGA's (pad size) , look closely to the via protection method they implemented (IPC-4761). You may also check with them before starting the placement, the reworkability aspects (Keep-out zones, Back to back bottom termination components (BTC, BGA) as examples. ) .
Depending on the pitch and ball size, 0.8mm and below, the stencil technology will play an important role and you have several options you can choose. A good stencil aligned with the board technology is a good investment.
Rgs
Michel
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jim West
Sent: 5 mai 2014 10:26
To: [log in to unmask]
Subject: [TN] Production with BGA's
Hi everyone,
A happy Monday to you all!
How many of you have experience with BGA's? We are looking at possibly having new designs that require BGA's. I have never ran, nor has my currently company, ran a process with BGA's and I'm trying to get my hands around everything needed to be successful. I believe my biggest concern will be the soldering process (material and process) and inspection afterwards. I feel pretty confident my paste printer, pick and place and reflow process will be capable of handling the BGA process based on feedback from the equipment manufacturers for those machines. I know this is a very broad question, but what do you guys think my focus should be on based on your experience? I have some time to prepare, so any feedback will be greatly appreciated. One specific question I do have is, will I need 100% X-Ray inspection?
Thanks,
Jim
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