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May 2014

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Subject:
From:
"Bush, Brien" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bush, Brien
Date:
Mon, 5 May 2014 14:59:19 +0000
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Hi Jim,
We do 100% X-ray inspection on all BGA and bottom terminated components. This is the best way to verify your process is in control.
The biggest problem we had to deal with was soldering a lead-free BGA to a leaded assembly. So many BGA's are only available in lead-free.

Good luck,

Brien Bush


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jim West
Sent: Monday, May 05, 2014 10:26 AM
To: [log in to unmask]
Subject: [TN] Production with BGA's - Bayesian Filter detected spam

Hi everyone,

A happy Monday to you all!

How many of you have experience with BGA's?  We are looking at possibly having new designs that require BGA's.  I have never ran, nor has my currently company, ran a process with BGA's and I'm trying to get my hands around everything needed to be successful.  I believe my biggest concern will be the soldering process (material and process) and inspection afterwards.  I feel pretty confident my paste printer, pick and place and reflow process will be capable of handling the BGA process based on feedback from the equipment manufacturers for those machines.  I know this is a very broad question, but what do you guys think my focus should be on based on your experience?  I have some time to prepare, so any feedback will be greatly appreciated.   One specific question I do have is, will I need 100% X-Ray inspection?

Thanks,
Jim


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