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May 2014

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Subject:
From:
"Ahmad, Syed" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ahmad, Syed
Date:
Mon, 5 May 2014 14:58:00 +0000
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In manufacturing, hundred percent inspection should only happen as a customer requirement. The aim of the process development team should be to transfer a process to manufacturing which requires only minimal sampling. BGAs have been made for long enough time to be able to develop a process free of any hundred percent inspection for any aspect of a BGA assembly. Hundred percent electrical testing may be necessary for binning purposes. IPC has a solder ball void acceptance criteria but void free process is possible. For prototypes and small quantities hundred percent inspection is unavoidable though. For large runs, sampling is necessary as mechanical set-up of complicated machines or chemical state of materials may change during the run.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jim West
Sent: Monday, May 05, 2014 9:26 AM
To: [log in to unmask]
Subject: [TN] Production with BGA's

Hi everyone,

A happy Monday to you all!

How many of you have experience with BGA's?  We are looking at possibly having new designs that require BGA's.  I have never ran, nor has my currently company, ran a process with BGA's and I'm trying to get my hands around everything needed to be successful.  I believe my biggest concern will be the soldering process (material and process) and inspection afterwards.  I feel pretty confident my paste printer, pick and place and reflow process will be capable of handling the BGA process based on feedback from the equipment manufacturers for those machines.  I know this is a very broad question, but what do you guys think my focus should be on based on your experience?  I have some time to prepare, so any feedback will be greatly appreciated.   One specific question I do have is, will I need 100% X-Ray inspection?

Thanks,
Jim


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