Hi everyone,

A happy Monday to you all!

How many of you have experience with BGA's?  We are looking at possibly having new designs that require BGA's.  I have never ran, nor has my currently company, ran a process with BGA's and I'm trying to get my hands around everything needed to be successful.  I believe my biggest concern will be the soldering process (material and process) and inspection afterwards.  I feel pretty confident my paste printer, pick and place and reflow process will be capable of handling the BGA process based on feedback from the equipment manufacturers for those machines.  I know this is a very broad question, but what do you guys think my focus should be on based on your experience?  I have some time to prepare, so any feedback will be greatly appreciated.   One specific question I do have is, will I need 100% X-Ray inspection?

Thanks,
Jim


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