Subject: | |
From: | |
Reply To: | |
Date: | Fri, 16 May 2014 15:37:20 +0000 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hello all,
When ordering foils per IPC-4562, there is an option for specifying "Bond Enhancement Treatment", and one can specify letter codes for:
N = No treatment, no stain proofing
P = No treatment, stain proofing both sides
S = Single Side bonding enhancement treatment (matte side), stain proofing both sides
D = Double Sided bond enhancement treatment, staing proofing both sides
R = Reverse-treated bond enhancement (cathode side), stain proofing both sides.
Can anyone explain what the "treatment" and "stain proofing" consists of? How does the bond enhancement treatment enhance the bond? I assume the implied "bond" is to epoxy in the PCB stack. Would either of these treatments effect solder wetting?
Thanks.
This E-mail is confidential. It may also be legally privileged. If you are not the addressee you may not copy, forward, disclose or use any part of it. If you have received this message in error, please delete it and all copies from your system and notify the sender immediately by return E-mail.
Internet communications cannot be guaranteed to be timely, secure, error or virus-free. The sender does not accept liability for any errors or omissions.
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
|
|