Ok, well one problem helps solve another....it seems that Technet server was not emailing any of us for the last week and IPC was not aware.

So I am reposting what I had sent along with a new question....


I found that I indeed had gotten Doug Pauls white paper IPC-WP-0012 "J-STD-001 Guidance on Objective Evidence of Material Compatibility" dated 8 January 2014.

Thank you Doug for being so proactive.

Phil



-----Original Message-----
From: Bavaro, Phillip @ MWG - TW
Sent: Wednesday, May 14, 2014 9:17 AM
To: [log in to unmask]
Subject: J-STD-001 Question regarding flux compatibility

Wow, it seems Technet has been very quiet lately.....so here is a question I faced yesterday:


Our PWA assembly process uses solder paste which contains flux classified as ORHO (for SMT).
We clean using DI water afterwards.  Then we hand install non-SMT components using core solder containing ROL0 flux and liquid flux classified as ROL1, and clean afterwards using alcohol (I know, I know).

During an audit, it was questioned whether or not we are in compliance with J-STD-001E Section 3.3 for compatibility.

My question to all of you is what does "data demonstrating compatibility" actually mean?

Is this compatibility between different fluxes, or between residues, or .....?






"3.3 Flux

Flux shall [D1D2D3] be in accordance with J-STD-004 or equivalent.
Flux shall [N1N2D3] conform to flux activity levels L0 and L1 of flux materials rosin (RO), resin (RE), or organic (OR), except ORL1 shall not [N1N2D3] be used for no-clean soldering.

When other activity levels or flux materials are used, data demonstrating compatibility shall [N1N2D3] be available for review (see 3.1).

Note: Flux or solder paste soldering process combinations previously tested or qualified in accordance with other specifications do not require additional testing."
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