IMC is pull-tested on a sample basis. Bondwire routing and location is 100% machine inspected (AOI). You use the correct combination of sampling and visual inspection to ensure that both the wire routing is correct, and the bond meets the strength requirement.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Wednesday, April 23, 2014 12:46 PM
To: [log in to unmask]
Subject: Re: [TN] Wire-bonding AOI
Why you need that? For al or Au? It is self testing by the bonder, if I am missed something.ý Besides, you always need to do imc. Inspection, aoi is not good enough. (can't see imc) .
"All professional skills are mastered by critiqued practice" - by Schon.
Original Message
From: Ioan TEMPEA
Sent: Wednesday, April 23, 2014 11:46 AM
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: [TN] Wire-bonding AOI
Dear Technos,
I need info regarding AOI machines with wire bonding inspection capability. Efficiency of the technology, suppliers, price tags, table top vs. inline, personal experiences, can they also do regular SMT AOI, anything you can tell me, on-line or off-line.
Any particular experience with this one? http://www.viscom.com/asia/products/wire-bond-inspection-aoi/s6053bo-vs6056bo-inline-aoi/
Thanks,
Ioan Tempea, P. Eng.
Manufacturing Engineer
Satellite Systems
MDA
21025 TransCanada Highway
Ste-Anne-de-Bellevue, Qc, Canada H9X 3R2
Tel: +1-514-457-2150-3556
www.mdacorporation.com<http://www.mdacorporation.com>
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