This is what says IPC/J-STD-001 E

4.2.2 Temperature and Humidity When humidity decreases to a level of 30% or
lower, the manufacturer shall [N1D2D3] verify that
electrostatic discharge control is adequate, and that the range of humidity
in the assembly area is sufficient to allow soldering and
assembly materials to function correctly in the process, based on vendor
recommendations or documented evidence of process
performance. For operator comfort and solderability maintenance, the
temperature should be maintained between 18°C [64.4°F] and
30°C [86°F] and the relative humidity should not exceed 70%. For process
control, more restrictive temperature and humidity limits
may be required

Regards

Gabriele


-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]] Per conto di Jim West
Inviato: mercoledì 23 aprile 2014 21.52
A: [log in to unmask]
Oggetto: [TN] Humidity levels within SMT/PCA factories.

Hi all,

Is there a standard written that covers required humidity levels within an
SMT/PCA plant?

What levels do others maintain in their factories where humidity is an
issue?

Thanks,
Jim


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