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April 2014

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Subject:
From:
Steven Creswick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steven Creswick <[log in to unmask]>
Date:
Tue, 22 Apr 2014 14:39:00 -0400
Content-Type:
text/plain
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text/plain (99 lines)
Joyce,

Is this the complete link for the document you cited?

http://www.mhtl.uwaterloo.ca/pdf_papers/mhtl03-3.pdf


Steve Creswick
Sr Associate - Balanced Enterprise Solutions
http://www.linkedin.com/in/stevencreswick
                         616 834 1883




-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Tuesday, April 22, 2014 2:12 PM
To: [log in to unmask]
Subject: Re: [TN] Seeking : Thermal Resistance onto PCB surface

You mean this?Review of Thermal Conductance Models for Joints Incorporating
...
mhtlab.uwaterloo.ca/pdf.../mhtl03-3.pdf
lic foils made of aluminum, copper, indium, lead, tin, etc., can be .....
involvingaluminum, copper, brass, gold, tin, and indium foils. .... that
polyamide fi lms coated with paraffi n-based thermal compound.

"All professional skills are mastered by critiqued practice" - by Schon.
  Original Message
From: Roland Jaquet
Sent: Tuesday, April 22, 2014 4:18 AM
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: [TN] Seeking : Thermal Resistance onto PCB surface


Dear Technetters,



I am confronted to an unusual challenge I am not able to solve. Can someone
help, if you please



We are seeking : Thermal Resistance onto PCB surface (14 layers) standard
approx.. 1.8 mm thick



Between



External Cu of approximately 30 to 35 metric microns covered with ENIG



And



Aluminum "Alodinized" 1200 or  Anodized in black



Thank you for your help





Meilleures salutations

Best Regards

Roland





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