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April 2014

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Tue, 8 Apr 2014 17:21:15 -0600
Content-Type:
text/plain
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Hi Chris,

Just throwing this out there. I don't know what kind of package you're
dealing with, you said 4-leads, could it be one like this?

http://media.digikey.com/photos/Allegro%20Microsystems/A1233LK-T.JPG

I know a solder joint is better than a socket, but maybe something to
consider is something like this:

http://documents.tycoelectronics.com/commerce/DocumentDelivery/DDEContro
ller?Action=showdoc&DocId=Specification+Or+Standard%7F114-13033%7FA%7Fpd
f%7FEnglish%7FENG_SS_114-13033_A.pdf


Steve 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Thierolf, Chris @
MPSG - SPD
Sent: Tuesday, April 8, 2014 1:01 PM
To: [log in to unmask]
Subject: [TN] Reattachment of leads

Is anyone familiar with the re-attachment of leads to a through hole
package when the original leads were cut? I have a very hard to find
package that had leads cut half length in attempts to make surface
mountable and want to add 4 leads to desired length. We tried a
resistance weld process through a vendor to fuse the leads together but
upon solder reflow the leads fell apart. I suspect thermal expansion or
insufficient bonding to be the cause under heat so I need an optional
process. Any ideas? The leads are tinned copper.

thanks

______________________________________

Chris Thierolf


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