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April 2014

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Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Tue, 8 Apr 2014 11:56:32 +0000
Content-Type:
text/plain
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text/plain (36 lines)
Both. The material at current state is not suitable for your process.

"All professional skills are mastered by critiqued practice" - by Schon.
  Original Message
From: lyonyuan
Sent: Tuesday, April 8, 2014 7:43 AM
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: [TN] solder mask peel off after Top sider reflow


Hi Team,



We found some PCBA boards(the same date code) with solder mask peel off
after Top side reflow. Material issue or process issue?



Lyon yuan





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