Fellow TechNetters:

   I have been handed a non-traditional PWB, the Top and Bottom layers are not the typical FR4 material, some type of poly film.   Is there information out there about tensile pull and tooth size?

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Friday, April 04, 2014 7:37 AM
To: [log in to unmask]
Subject: Re: [TN] tensile strength and elongation

Louis, if you are looking for more than tensile and elongation, you might have to seek in conference paper and magazines. Such as surface morphology (smooth surface with large crystal and low organic inclusion for example).
Best regards,

Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Friday, April 04, 2014 8:32 AM
To: [log in to unmask]
Subject: Re: [TN] tensile strength and elongation

Hi Louis - another good reference is Modern Electroplating by Frederick Lowenheim, ISBN 0-471-54968-1. It has a good section on electroplated copper that may be useful.

Dave Hillman
Rockwell Collins
[log in to unmask]




From: Louis Hart
To:
Date: 04/03/2014 05:37 PM
Subject: [TN] tensile strength and elongation
Sent by: TechNet



Technetters, may I have some comments or advice about process parameters affecting electroplated copper tensile strength and elongation? Many months ago Inge pointed me to Safranek's book on electrodeposited. I would like to have a better sense of how chemical parameters in the plating bath impact copper properties. We have a DC and a reverse pulse plating line.

I am going back to Safranek's book again, but any guidance from you all would be welcome - research papers, application notes, books, your own experience. Thanks for anything.

Any comments on the effects of electrical plating parameters on tensile strength and elongation would be appreciated as well.

Louis Hart

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