Hi Louis -  another good reference is Modern Electroplating by Frederick
Lowenheim, ISBN 0-471-54968-1. It has a good section on electroplated
copper that may be useful.

Dave Hillman
Rockwell Collins
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From:   Louis Hart <[log in to unmask]>
To:     <[log in to unmask]>
Date:   04/03/2014 05:37 PM
Subject:        [TN] tensile strength and elongation
Sent by:        TechNet <[log in to unmask]>



Technetters, may I have some comments or advice about process parameters
affecting electroplated copper tensile strength and elongation?  Many
months ago Inge pointed me to Safranek's book on electrodeposited.  I
would like to have a better sense of how chemical parameters in the
plating bath impact copper properties. We have a DC and a reverse pulse
plating line.

I am going back to Safranek's book again, but any guidance from you all
would be welcome - research papers, application notes, books, your own
experience.  Thanks for anything.

Any comments on the effects of electrical plating parameters on tensile
strength and elongation would be appreciated as well.

Louis Hart

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