Technetters, may I have some comments or advice about process parameters affecting electroplated copper tensile strength and elongation?  Many months ago Inge pointed me to Safranek's book on electrodeposited.  I would like to have a better sense of how chemical parameters in the plating bath impact copper properties. We have a DC and a reverse pulse plating line.

I am going back to Safranek's book again, but any guidance from you all would be welcome - research papers, application notes, books, your own experience.  Thanks for anything.

Any comments on the effects of electrical plating parameters on tensile strength and elongation would be appreciated as well.

Louis Hart

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