Hi Tuyen Tran,

Is pad lifted after SMT Reflow an acceptable condition at plated-thru-slot 
for SMT boards?  What are the IPC reference for such acceptance or 
rejection criteria for pad lifted at plated-thru slot after SMT Reflow? 
For your info, such slot will be inserted with a large Battery for manual 
soldering by our Customer later.

Best regards,

Joseph




Tuyen Tran <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
04/28/2014 04:00 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Tuyen Tran      <[log in to unmask]>


To
<[log in to unmask]>
cc

Subject
Re: [TN] Interpretation for IPC 600H for Clause 3.3.2 (Lifted Land - Cross 
Sectioned)






Hi Joseph
In IPC 600H criteria clause 3.3.2 only apply for plated through hole not 
for SMT.

Best regards
Tuyen Tran (CIT-IPC610)

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joseph Khiew
Sent: Monday, April 28, 2014 1:42 PM
To: [log in to unmask]
Subject: [TN] Interpretation for IPC 600H for Clause 3.3.2 (Lifted Land - 
Cross Sectioned)

We found repeated pad lifted after different SMT Reflow temperature (eg: 
243 deg C and 233 deg C) at an isolated slot.  The PCB Supplier had 
claimed that such condition is acceptable as per IPC 600H Clause 3.3.2 
(Cross Sections)  - eg: Acceptable - Class 1,2,3 = After thermal stress 
testing or rework simulation - Lifted lands are allowed. 

Upon consultation with our Customer, such pad lifted cannot be concessed 
(rejected).  Appreciate advise if such interpretation of Clause 3.3.2 by 
the Supplier is correct.

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________



______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________