"All professional skills are mastered by critiqued practice" - by Schon.
  Original Message
From: Joyce Koo <[log in to unmask]>
Sent: Wednesday, April 23, 2014 11:14 PM
To: Stadem, Richard D.
Subject: Re: [TN] Wire-bonding AOI


There are developing process regarding the wire bonding. Usually, you do ball size inspection for consistency, ball share for initial strength, aging and wet chemical etch plus cross section for intermetallic coverage and thickness (depend upon the die metallization and thickness, composition of both your wire and pads). Table tear usually good enough for second bond strength, the modern machine will automatically identify "no stick". Wire loop is based on visual, with current state of the art bonds per device reach to 1000 or more and multi-teir stack type, aoi? With speed of bonder, very difficult. As for process monitoring, bond 15 at every 4 hour interval, and do wire pull (stitch peel) and ball shear, will be the same guide after a fully developed process. (or you can ask for 5 bonds per direction, just in case you have problem optimize different travel directions). My 1.8 cents.

"All professional skills are mastered by critiqued practice" - by Schon.
  Original Message
From: Stadem, Richard D.
Sent: Wednesday, April 23, 2014 5:27 PM
To: TechNet E-Mail Forum; Joyce Koo
Subject: RE: [TN] Wire-bonding AOI


IMC is pull-tested on a sample basis. Bondwire routing and location is 100% machine inspected (AOI). You use the correct combination of sampling and visual inspection to ensure that both the wire routing is correct, and the bond meets the strength requirement.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joyce Koo
Sent: Wednesday, April 23, 2014 12:46 PM
To: [log in to unmask]
Subject: Re: [TN] Wire-bonding AOI

Why you need that? For al or Au? It is self testing by the bonder, if I am missed something.‎ Besides, you always need to do imc. Inspection, aoi is not good enough. (can't see imc) .

"All professional skills are mastered by critiqued practice" - by Schon.
  Original Message
From: Ioan TEMPEA
Sent: Wednesday, April 23, 2014 11:46 AM
To: [log in to unmask]
Reply To: TechNet E-Mail Forum
Subject: [TN] Wire-bonding AOI


Dear Technos,

I need info regarding AOI machines with wire bonding inspection capability. Efficiency of the technology, suppliers, price tags, table top vs. inline, personal experiences, can they also do regular SMT AOI, anything you can tell me, on-line or off-line.

Any particular experience with this one? http://www.viscom.com/asia/products/wire-bond-inspection-aoi/s6053bo-vs6056bo-inline-aoi/

Thanks,

Ioan Tempea, P. Eng.
Manufacturing Engineer
Satellite Systems
MDA
21025 TransCanada Highway
Ste-Anne-de-Bellevue, Qc, Canada H9X 3R2
Tel: +1-514-457-2150-3556
www.mdacorporation.com<http://www.mdacorporation.com>

This e-mail, and any attachments, are intended solely for the use of the intended recipient(s) and may contain legally privileged, proprietary and/or confidential information. Any use, disclosure, dissemination, distribution or copying of this e-mail and any attachments for any purposes that have not been specifically authorized by the sender is strictly prohibited. If you are not the intended recipient, please immediately notify the sender by reply e-mail and permanently delete all copies and attachments.


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] ______________________________________________________________________

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________