Hi Joseph
In IPC 600H criteria clause 3.3.2 only apply for plated through hole not for SMT.
Best regards
Tuyen Tran (CIT-IPC610)
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Joseph Khiew
Sent: Monday, April 28, 2014 1:42 PM
To: [log in to unmask]
Subject: [TN] Interpretation for IPC 600H for Clause 3.3.2 (Lifted Land - Cross Sectioned)
We found repeated pad lifted after different SMT Reflow temperature (eg: 243 deg C and 233 deg C) at an isolated slot. The PCB Supplier had claimed that such condition is acceptable as per IPC 600H Clause 3.3.2 (Cross Sections) - eg: Acceptable - Class 1,2,3 = After thermal stress testing or rework simulation - Lifted lands are allowed.
Upon consultation with our Customer, such pad lifted cannot be concessed (rejected). Appreciate advise if such interpretation of Clause 3.3.2 by the Supplier is correct.
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