We found repeated pad lifted after different SMT Reflow temperature (eg: 243 deg C and 233 deg C) at an isolated slot. The PCB Supplier had claimed that such condition is acceptable as per IPC 600H Clause 3.3.2 (Cross Sections) - eg: Acceptable - Class 1,2,3 = After thermal stress testing or rework simulation - Lifted lands are allowed.
Upon consultation with our Customer, such pad lifted cannot be concessed (rejected). Appreciate advise if such interpretation of Clause 3.3.2 by the Supplier is correct.