Al bond on Ag spot plated leadframe?  Or gold plated leadframe?  You need more just FA, you need know bonding machine and frequency, etc. etc.  a process development on its own... better not on a product...(a bit late if it is done on product - very costly... you must have deep pocket for Vlad ;-)

Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Friday, March 21, 2014 8:36 AM
To: [log in to unmask]
Subject: [TN] Failure Analysis Labs for Heavy Wire Bonding Issues

Good morning everyone!

Hoping someone can help on this somewhat unique situation - 

A party is performing heavy wire Al bonding of 12 & 20 mil wire between a PWB and the leads of an over-molded package.  

They are looking for an outside lab to perform testing/failure analysis in an attempt to determine the root cause/s of frequent bond misses.  (It appears they have minimal analysis capability in-house.)

The first things that I think of with heavy wire Al bonding issues are insufficient clamping during bonding, mold flash on the leads, mold release on the leads, and lead oscillation (harmonics) during bonding.

Does anyone know of a good failure analysis lab that can provide these services?  The company is located in the central US, but ultimately, the lab can be anywhere.

Two possible that come to mind are:

Foresite Labs - http://www.residues.com/

Constellation Technology, in Largo, Florida - http://www.contech.com/

Anyone have others??


Steve Creswick
Sr Associate - Balanced Enterprise Solutions http://www.linkedin.com/in/stevencreswick
                         616 834 1883




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