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March 2014

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Subject:
From:
Steven Creswick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steven Creswick <[log in to unmask]>
Date:
Fri, 21 Mar 2014 08:36:08 -0400
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Good morning everyone!

Hoping someone can help on this somewhat unique situation - 

A party is performing heavy wire Al bonding of 12 & 20 mil wire between a
PWB and the leads of an over-molded package.  

They are looking for an outside lab to perform testing/failure analysis in
an attempt to determine the root cause/s of frequent bond misses.  (It
appears they have minimal analysis capability in-house.)

The first things that I think of with heavy wire Al bonding issues are
insufficient clamping during bonding, mold flash on the leads, mold release
on the leads, and lead oscillation (harmonics) during bonding.

Does anyone know of a good failure analysis lab that can provide these
services?  The company is located in the central US, but ultimately, the lab
can be anywhere.

Two possible that come to mind are:

Foresite Labs - http://www.residues.com/

Constellation Technology, in Largo, Florida - http://www.contech.com/

Anyone have others??


Steve Creswick
Sr Associate - Balanced Enterprise Solutions
http://www.linkedin.com/in/stevencreswick
                         616 834 1883




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