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March 2014

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Subject:
Re: BGA non wetting pads
From:
Karen Tellefsen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Karen Tellefsen <[log in to unmask]>
Date:
Thu, 13 Mar 2014 10:20:45 -0400
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Two papers from Intel

Fundamentals Of The Non-Wet Open BGA Solder Joint Defect Formation
http://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=3447

The Challenges Of Non Wet Open BGA Solder Defect
http://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=3547

Karen Tellefsen - Electrical Testing
Alpha / 109 Corporate Blvd./ S. Plainfield, NJ 07080
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908-791-3069



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