Hi Todd,

two good stnds for pull and shear strength test are :

Gull Wing terminations:

IEC 62137-1-1, Ed. 1: Surface mounting technology – Environmental and
endurance test methods for surface mount solder joint – Part 1-1: pull
strength test

Chips metalized terminations:

IEC 62137-1-2, Ed. 1: Surface mounting technology – Environmental and
endurance test methods for surface mount solder joint – Part 1-2: Shear
strength test

They tell you the method how to perform the tests, but they do not provide
any value of strength.

You need to compare test results with those in your data base. Results that
can be influenced by many variables.

Ie. To compare strength values of soldered terminations by using SnPb alloy
to Lead Free solder joint same termination style or component, etc.
Or compare strength values at Time Zero (post reflow) with strength after
Thermal Cycles, etc.

Gabriele

 
-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]] Per conto di MacFadden, Todd
Inviato: mercoledì 12 marzo 2014 17.04
A: [log in to unmask]
Oggetto: [TN] Solder Joint Interconnect Pull Strength Tests - Standards?

Is anyone aware of standards for conducting and evaluating lead pull tests,
and are there typical expected lead pull (or push) values for the common
interconnects (i.e., gull wing, castellation, BGA, chip cap terminals, etc).

Perhaps there are too many variables -- e.g., type, finish, configuration
and size of the lead; solder type, etc. -- to establish standard pull
strength values. We've always just used relative comparison of values from
sample lots against controls, but I'm wondering if there are typical
expected pull strength values from industry we can reference.

I noted from MIL-STD-1580B: 10.1.1.2 Terminal strength. Perform a lead pull
strength test on all parts (two parts minimum) in accordance with the
applicable specification. But what is the "applicable specification" being
referred to here?


Thanks in advance!
Todd MacFadden


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