Hi Todd - I don't know of any solder joint pull tests that have minimum 
and/or typical values associated with the method. As you detailed, there 
are a bunch of variables that can influence the measured tensile value 
that you record for a given test. There are a number of investigations 
that have published pull test data but it was used in a comparison mode - 
a gold finished pin versus a palladium finished pin for a specific test 
vehicle/cross head speed/specific diameter. One data source that might be 
of use is the International Tin Research Institute Publication No. 656 
which contains a wealth of shear and tensile data for several solder 
alloys and test parameters. Most of that data is based on copper "ring and 
plug" solder joints. Perhaps some of that data could be useful for your 
efforts.

Dave Hillman
Rockwell Collins
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From:   "MacFadden, Todd" <[log in to unmask]>
To:     <[log in to unmask]>
Date:   03/12/2014 11:06 AM
Subject:        [TN] Solder Joint Interconnect Pull Strength Tests - 
Standards?
Sent by:        TechNet <[log in to unmask]>



Is anyone aware of standards for conducting and evaluating lead pull 
tests, and are there typical expected lead pull (or push) values for the 
common interconnects (i.e., gull wing, castellation, BGA, chip cap 
terminals, etc).

Perhaps there are too many variables -- e.g., type, finish, configuration 
and size of the lead; solder type, etc. -- to establish standard pull 
strength values. We've always just used relative comparison of values from 
sample lots against controls, but I'm wondering if there are typical 
expected pull strength values from industry we can reference.

I noted from MIL-STD-1580B: 10.1.1.2 Terminal strength. Perform a lead 
pull strength test on all parts (two parts minimum) in accordance with the 
applicable specification. But what is the "applicable specification" being 
referred to here?


Thanks in advance!
Todd MacFadden


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