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March 2014

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bev Christian <[log in to unmask]>
Date:
Fri, 7 Mar 2014 20:35:02 -0500
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I agree with Steve.
Bev

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Creswick
Sent: Friday, March 07, 2014 4:27 PM
To: [log in to unmask]
Subject: Re: [TN] Fluxing Underfills

Greg,

Besides what Doug said,

It all depends...  If you have silicon on silicon you can do a bang-up job
with the unfilled flux underfills.  If you are going Si to laminate, you
best plan on using a filled material.  Even if you have to go with a
post-applied capillary underfill.

Regarding repairability.  They say they are, but ... rework can be a real
&$@%

Better to assume you have a non-repairable assembly and do your homework up
front, if you can - or just bit the bullet and go to a post-applied
underfill after test and rework.

My parting shot for the day


Steve Creswick
Sr Associate - Balanced Enterprise Solutions
http://www.linkedin.com/in/stevencreswick
                         616 834 1883



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Greg Munie
Sent: Friday, March 07, 2014 2:55 PM
To: [log in to unmask]
Subject: [TN] Fluxing Underfills

Anyone have any experience with fluxing underfills?

How well do they work on larger bumped packages?

Are they repairable?

The question came up here at IPC but I've been out of the flux business too
long to answer.


Greg Munie Ph.D.
Director of Design Programs
+1-847-616-7100 tel
+1-847-597-2803 direct
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www.ipc.org<http://www.ipc.org/>

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