Two papers from Intel
Fundamentals Of The Non-Wet Open BGA Solder Joint Defect Formation
http://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=3447
The Challenges Of Non Wet Open BGA Solder Defect
http://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=3547
Karen Tellefsen - Electrical Testing
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