Hi Pat,

From your photo it looks to me like that it's not plating that has peeled up, but that someone did some sort of "repair" maybe to fix an intermittent contact of those fingers.

I say that because the gouges look really deep on the lower two pads in comparison to the top one, and from the way the solder build-up appears on the left side of the middle pad, it almost looks like someone laid a pad on top of the finger and tried to solder it to the lower one on the board.

I may be just seeing things though...

Steve 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Patrick Goodyear
Sent: Monday, February 17, 2014 10:02 AM
To: [log in to unmask]
Subject: [TN] FW: [TN] Plating problems on a board

I uploaded a picture to the gallery, any help would be appreciated.    I 
think I have the material I need to replate using solder and wiping with 
wick.    I have a copper plating kit and a cleaning kit.

Pat


-------- Begin forwarded message --------
Subject: [TN] Plating problems on a board
Date: 2/16/14 9:24:59 PM
From: "Patrick Goodyear" <[log in to unmask]>
To: [log in to unmask]


Ok industry experts, I’m back to my old stomping grounds for a refuel / repair outage.

I have a board that has what appears to be solder reflow or tin plating over the top of copper plated edge fingers on the power connections. The plated surface was pealed off during cleaning using dust-off aerosol. 
The pealed pad readily melts under a soldering iron, material would be 
63-37 solder or pure tin.    It does not appear to be silver plating. 
The back side of the pealed pieces have a copper patina to them, indicating the bonds have failed.

My question is, what is the best way to repair/reflow the fingers?    Do 
they need to be re-plated with copper prior to reflow?   I looked in the 
copy of 7721 we have but can find nothing specific only for replating 
with gold or silver.    This board is used in a HIGH Reliability system.

Pat Goodyear
Temp PG&E.

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