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February 2014

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Subject:
From:
Patrick Goodyear <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 17 Feb 2014 12:02:13 -0500
Content-Type:
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I uploaded a picture to the gallery, any help would be appreciated.    I 
think I have the material I need to replate using solder and wiping with 
wick.    I have a copper plating kit and a cleaning kit.

Pat


-------- Begin forwarded message --------
Subject: [TN] Plating problems on a board
Date: 2/16/14 9:24:59 PM
From: "Patrick Goodyear" <[log in to unmask]>
To: [log in to unmask]


Ok industry experts, I’m back to my old stomping grounds for a refuel / 
repair outage.

I have a board that has what appears to be solder reflow or tin plating 
over the top of copper plated edge fingers on the power connections. The 
plated surface was pealed off during cleaning using dust-off aerosol. 
The pealed pad readily melts under a soldering iron, material would be 
63-37 solder or pure tin.    It does not appear to be silver plating. 
The back side of the pealed pieces have a copper patina to them, 
indicating the bonds have failed.

My question is, what is the best way to repair/reflow the fingers?    Do 
they need to be re-plated with copper prior to reflow?   I looked in the 
copy of 7721 we have but can find nothing specific only for replating 
with gold or silver.    This board is used in a HIGH Reliability system.

Pat Goodyear
Temp PG&E.

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