Ok industry experts, I’m back to my old stomping grounds for a refuel / 
repair outage.

I have a board that has what appears to be solder reflow or tin plating 
over the top of copper plated edge fingers on the power connections. 
The plated surface was pealed off during cleaning using dust-off 
aerosol.     The pealed pad readily melts under a soldering iron, 
material would be 63-37 solder or pure tin.    It does not appear to be 
silver plating.    The back side of the pealed pieces have a copper 
patina to them, indicating the bonds have failed.

My question is, what is the best way to repair/reflow the fingers?    Do 
they need to be re-plated with copper prior to reflow?   I looked in the 
copy of 7721 we have but can find nothing specific only for replating 
with gold or silver.    This board is used in a HIGH Reliability system.

Pat Goodyear
Temp PG&E.