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February 2014

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From:
Douglas Pauls <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 12 Feb 2014 10:49:15 -0600
Content-Type:
text/plain
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text/plain (289 lines)
 Ed,
In your study, make note of whether the surface you are testing rested 
against any packing material (like polyethylene shrink wrap) or interleave 
material (like paper or Silver Saver).  I have found that boards from the 
center of the pack of boards can sometimes have different energy than 
those that are at the top or bottom.

Doug Pauls



From:   Ed Popielarski <[log in to unmask]>
To:     <[log in to unmask]>
Date:   02/12/2014 09:57 AM
Subject:        Re: [TN] [COM] Solder Mask Surface Tension for Conformal 
Coating Adhesion
Sent by:        TechNet <[log in to unmask]>



I'm launching a study here to try to correlate variation in soldermask 
surface activity measured with Dyne Pens vs. "spotty" defects we see from 
time to time. My theory is that the "out of the box" surface activity may 
be marginal in some cases, and wetting problems exacerbated by 
environmental (handling, atmosphere, etc.) influences that would have 
negligible effect if the activity were otherwise better.

I've selected 5 Dyne "classes" as a sorting mechanism, 46+, 42+, 36+,30+, 
30- and will test one board per "batch", i.e., P/N & Job No. & record 
measured value. I will have inspection scrutinize for dewetted spots and 
advise before touchup so I can record the defect in its appropriate entry.

I'll let y'all know if there are any interesting results.

Ed Popielarski
Engineering Manager


                               970 NE 21st Ct.
                              Oak Harbor, Wa. 98277

                              Ph: 360-675-1322
                              Fx: 206-624-0695
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https://maps.google.com/maps/myplaces?hl=en&ll=48.315753,-122.643578&spn=0.011188,0.033023&ctz=420&t=m&z=16&iwloc=A



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Braddock, Iain (UK)
Sent: Wednesday, February 12, 2014 7:41 AM
To: [log in to unmask]
Subject: Re: [TN] [COM] Solder Mask Surface Tension for Conformal Coating 
Adhesion

Doug,

Hmm....now why did I not think of that?

The trouble is I am working on a special project that requires expensive 
complicated processing so I was hoping to steal a lead from someone with 
experience in this area - not being one for reinventing the wheel.

                Iain

From: [log in to unmask] [mailto:[log in to unmask]]
Sent: 12 February 2014 13:39
To: TechNet E-Mail Forum; Braddock, Iain (UK)
Subject: Re: [TN] [COM] Solder Mask Surface Tension for Conformal Coating 
Adhesion


                      *** WARNING ***
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Iain, quite simple.  Start with a bad level for the material then improve 
it until it is not bad anymore.  That will be your good level.

I love being helpful.

Doug Pauls



From:        "Braddock, Iain (UK)" <[log in to unmask]<
mailto:[log in to unmask]>>
To:        <[log in to unmask]<mailto:[log in to unmask]>>
Date:        02/12/2014 04:24 AM
Subject:        Re: [TN] [COM] Solder Mask Surface Tension for Conformal 
Coating Adhesion
Sent by:        TechNet <[log in to unmask]<mailto:[log in to unmask]>>
________________________________



Hi all,

On the Dyne pens theme, does anyone had an idea what would be a good value 
for a Taconic TLY3 double sided laminate that has had one side of Cu 
etched away.

Regards,
                Iain

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of GRIVON Arnaud
Sent: 11 February 2014 08:05
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: Re: [TN] [COM] Solder Mask Surface Tension for Conformal Coating 
Adhesion

*** WARNING ***
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external partner or the Global Internet.
Keep this in mind if you answer this message.

Hello,

Thank you for the clear information provided.
As a supplement, I would be interested in someone could give the reference 
of the mentioned ASTM standard for surface energy measurement by Dyne 
Pens.
Also wondering why there is no IPC standard or guideline on this topic, as 
conformal coating adhesion on solder mask is a quite common concern within 
the industry.
It looks like indications given by Doug are acknowledged as good practice 
and therefore could be introduced within IPC standards.
Best regards,

Arnaud Grivon

-----Message d'origine-----
De : TechNet [mailto:[log in to unmask]] De la part de Lee Hitchens Envoyé : 
mardi 4 février 2014 07:26 À : [log in to unmask]<mailto:[log in to unmask]> 
Objet : Re: [TN] [COM] Solder Mask Surface Tension for Conformal Coating 
Adhesion

Hi Arnaud

I agree with Doug on this on using Dyne Pens although with no clean 
processing generally you are lucky if you can get close to the range of 
35-40! We tend to be working in the lower range of this.

It's also solder resist / coating dependent. Don't dismiss the energy 
value out of hand immediately. There is no logic sometimes to selection. 
We found one case where we tried absolutely any coating we could find to 
stick to a solder resist and only one did. No idea why and none of the 
chemists could explain.


Best Regards

Lee Hitchens


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas Pauls
Sent: 03 February 2014 17:01
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: Re: [TN] [COM] Solder Mask Surface Tension for Conformal Coating 
Adhesion

Arnaud,
I think you are asking about surface energy rather than surface tension.
We use the readily available Dyne Pens which have solutions calibrated 
back to an ASTM standard.

I generally use this rule of thumb regardless of the coating used.

Under 30 dynes/cm:  Coating adhesion will be poor
30-35 dynes/cm:  Coating adhesion will be slightly better, but you can 
expect more frequent cases of delamination.
35-40 dynes/cm:  Coating adhesion generally good, but can have some 
periodic delamination or adhesion issues.
40-45 dynes/cm:  Coating adhesion is good and only rarely will you see 
delamination problems
45+ dynes.cm:  Good adhesion.

Of course, there will always be special cases but this is a good starting 
point.

Doug Pauls



From:   GRIVON Arnaud <[log in to unmask]<
mailto:[log in to unmask]>>
To:     <[log in to unmask]<mailto:[log in to unmask]>>
Date:   02/03/2014 10:48 AM
Subject:        [TN] [COM] Solder Mask Surface Tension for Conformal
Coating Adhesion
Sent by:        TechNet <[log in to unmask]<mailto:[log in to unmask]>>



Hello TechNet,

I would like to sense the best practices in terms of solder mask surface 
tension with respect to conformal coating adhesion :

-          Which standard/test method are you using?

-          Which requirement (e.g. minimum value in dyn/cm²) would you
accept for the various CC types (acrylics, urethanes, silicone, parylene)?
Thanks in advance for the insights.
Best regards,

Arnaud Grivon


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Hertfordshire, SG1 2DA, England.

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