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February 2014

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Subject:
From:
"lduso - Diamond-MT.com" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, lduso - Diamond-MT.com
Date:
Tue, 11 Feb 2014 14:09:43 -0500
Content-Type:
text/plain
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text/plain (199 lines)
Well done sir!! I applaud your courage in this undertaking!! We wait with
bated breath....

Although in all fairness, I really do not believe you "jumped on that
grenade" as much as you said, "Oh look, a grenade!" and then you were
summarily tossed upon said grenade.

Regardless, I'm sure Mr. Pauls will shed a tear and tip his glass of Dew as
he speaks of your courage under fire at your memorial. A true hero like no
other.

I can't wait to see what you come up with! And APEX just next month!

Lloyd Duso
Diamond-MT
Plant Manager
(814) 535-3505
www.Diamond-mt.com


On Tue, Feb 11, 2014 at 8:44 AM, Stadem, Richard D. <
[log in to unmask]> wrote:

> Oh Lord, help me......
>
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: Tuesday, February 11, 2014 7:30 AM
> To: TechNet E-Mail Forum; Stadem, Richard D.
> Subject: Re: [TN] [COM] Solder Mask Surface Tension for Conformal Coating
> Adhesion
>
> Good morning everyone,
>
> I would like to introduce you all to Richard Dean Stadem, the newly
> elected chairman of 5-31Q The Surface Energy Task Group....
>
> Doug Pauls
>
>
>
> From:        "Stadem, Richard D." <[log in to unmask]<mailto:
> [log in to unmask]>>
> To:        <[log in to unmask]<mailto:[log in to unmask]>>
> Date:        02/11/2014 07:10 AM
> Subject:        Re: [TN] [COM] Solder Mask Surface Tension for Conformal
> Coating Adhesion
> Sent by:        TechNet <[log in to unmask]<mailto:[log in to unmask]>>
> ________________________________
>
>
>
> Good suggestion. I would go so far as to recommend a section in IPC-TM-650
> providing "general" instruction in the method. All of the dyne pen sets I
> have used do have some very basic instruction, but it could be standardized.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of GRIVON Arnaud
> Sent: Tuesday, February 11, 2014 2:05 AM
> To: [log in to unmask]<mailto:[log in to unmask]>
> Subject: Re: [TN] [COM] Solder Mask Surface Tension for Conformal Coating
> Adhesion
>
> Hello,
>
> Thank you for the clear information provided.
> As a supplement, I would be interested in someone could give the reference
> of the mentioned ASTM standard for surface energy measurement by Dyne Pens.
> Also wondering why there is no IPC standard or guideline on this topic, as
> conformal coating adhesion on solder mask is a quite common concern within
> the industry.
> It looks like indications given by Doug are acknowledged as good practice
> and therefore could be introduced within IPC standards.
> Best regards,
>
> Arnaud Grivon
>
> -----Message d'origine-----
> De : TechNet [mailto:[log in to unmask]] De la part de Lee Hitchens Envoyé :
> mardi 4 février 2014 07:26 À : [log in to unmask]<mailto:[log in to unmask]>
> Objet : Re: [TN] [COM] Solder Mask Surface Tension for Conformal Coating
> Adhesion
>
> Hi Arnaud
>
> I agree with Doug on this on using Dyne Pens although with no clean
> processing generally you are lucky if you can get close to the range of
> 35-40! We tend to be working in the lower range of this.
>
> It's also solder resist / coating dependent. Don't dismiss the energy
> value out of hand immediately. There is no logic sometimes to selection. We
> found one case where we tried absolutely any coating we could find to stick
> to a solder resist and only one did. No idea why and none of the chemists
> could explain.
>
>
> Best Regards
>
> Lee Hitchens
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Douglas Pauls
> Sent: 03 February 2014 17:01
> To: [log in to unmask]<mailto:[log in to unmask]>
> Subject: Re: [TN] [COM] Solder Mask Surface Tension for Conformal Coating
> Adhesion
>
> Arnaud,
> I think you are asking about surface energy rather than surface tension.
> We use the readily available Dyne Pens which have solutions calibrated
> back to an ASTM standard.
>
> I generally use this rule of thumb regardless of the coating used.
>
> Under 30 dynes/cm:  Coating adhesion will be poor
> 30-35 dynes/cm:  Coating adhesion will be slightly better, but you can
> expect more frequent cases of delamination.
> 35-40 dynes/cm:  Coating adhesion generally good, but can have some
> periodic delamination or adhesion issues.
> 40-45 dynes/cm:  Coating adhesion is good and only rarely will you see
> delamination problems
> 45+ dynes.cm:  Good adhesion.
>
> Of course, there will always be special cases but this is a good starting
> point.
>
> Doug Pauls
>
>
>
> From:   GRIVON Arnaud <[log in to unmask]<mailto:
> [log in to unmask]>>
> To:     <[log in to unmask]<mailto:[log in to unmask]>>
> Date:   02/03/2014 10:48 AM
> Subject:        [TN] [COM] Solder Mask Surface Tension for Conformal
> Coating Adhesion
> Sent by:        TechNet <[log in to unmask]<mailto:[log in to unmask]>>
>
>
>
> Hello TechNet,
>
> I would like to sense the best practices in terms of solder mask surface
> tension with respect to conformal coating adhesion :
>
> -          Which standard/test method are you using?
>
> -          Which requirement (e.g. minimum value in dyn/cm²) would you
> accept for the various CC types (acrylics, urethanes, silicone, parylene)?
> Thanks in advance for the insights.
> Best regards,
>
> Arnaud Grivon
>
>
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