Lars,

Sorry, but the forum strips all attachment so no one can see what you are
attempting to illustrate.

The IPC does offer file space for sharing images, etc. -
http://ipc-technet.groupsite.com/main/summary

Steve C

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lars Wallin
Sent: Thursday, February 06, 2014 8:15 AM
To: [log in to unmask]
Subject: [TN] VB: Lödproblem + bild

Hello Technet,

Please check the attach sketch.
It involves soldering a large capacitor (20 x 30 x 40 mm see enclosed
picture) and then mould in the whole board with a warm polyuretan mould
mass. The requirement is that the solder joint should withstand 300 cycles
(from-40C to +85 C).

Figure A, can not cope with the requirement of 300 cycles. a =  polyurethane
mass.

Which of the figures B-E do you think would be a better solution? Or would
you suggest any other solution?

Looking forward to your answer.

Best Regards
Lars Wallin
IPC European Representative
Location: Stockholm, Sweden
Phone:  +46 8 26 10 07
Mobile: +46 70 212 74 39
Email: [log in to unmask]<mailto:[log in to unmask]>

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