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Date: | Thu, 6 Feb 2014 13:20:02 +0000 |
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Technet strip all the attachment.
Joyce Koo
Researcher
Materials Interconnect Lab
Office: (519) 888-7465 79945
BlackBerry: (226) 220-4760
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lars Wallin
Sent: Thursday, February 06, 2014 8:15 AM
To: [log in to unmask]
Subject: [TN] VB: Lödproblem + bild
Hello Technet,
Please check the attach sketch.
It involves soldering a large capacitor (20 x 30 x 40 mm see enclosed picture) and then mould in the whole board with a warm polyuretan mould mass. The requirement is that the solder joint should withstand 300 cycles (from-40C to +85 C).
Figure A, can not cope with the requirement of 300 cycles. a = polyurethane mass.
Which of the figures B-E do you think would be a better solution? Or would you suggest any other solution?
Looking forward to your answer.
Best Regards
Lars Wallin
IPC European Representative
Location: Stockholm, Sweden
Phone: +46 8 26 10 07
Mobile: +46 70 212 74 39
Email: [log in to unmask]<mailto:[log in to unmask]>
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