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February 2014

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Subject:
VB: Lödproblem + bild
From:
Lars Wallin <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lars Wallin <[log in to unmask]>
Date:
Thu, 6 Feb 2014 13:14:46 +0000
Content-Type:
text/plain
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text/plain (19 lines) 
Hello Technet,

Please check the attach sketch.
It involves soldering a large capacitor (20 x 30 x 40 mm see enclosed picture) and then mould in the whole board with a warm polyuretan mould mass. The requirement is that the solder joint should withstand 300 cycles (from-40C to +85 C).

Figure A, can not cope with the requirement of 300 cycles. a =  polyurethane mass.

Which of the figures B-E do you think would be a better solution? Or would you suggest any other solution?

Looking forward to your answer.

Best Regards
Lars Wallin
IPC European Representative
Location: Stockholm, Sweden
Phone:  +46 8 26 10 07
Mobile: +46 70 212 74 39
Email: [log in to unmask]<mailto:[log in to unmask]>

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