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February 2014

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Subject:
From:
Wayne Thayer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wayne Thayer <[log in to unmask]>
Date:
Thu, 6 Feb 2014 00:44:07 +0000
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I don't want to get in some kind of on line spat over this, but I recommend that whoever is doing the wirebonding calls out the surface finish!  If that person has any experience, they will only commit to the finish after the vendor provides a sample they can test with.  For many this would not be enough and they would send it out to a lab for full analysis so they can use it as a baseline and verify that the actual production boards have the same finish.

Wirebonding issues mostly have to do with surface finish and contamination:  Solve those and generally you can have a pretty good day!

Wayne Thayer

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kenneth Wood
Sent: Wednesday, February 05, 2014 6:51 PM
To: [log in to unmask]
Subject: Re: [TN] Wire Bonding Spec?

Jack,
Use ENEPIG surface finish. A bit pricey but pretty good for wire bonding.
Ken
_____________________________________
Kenneth J. Wood
Saturn PCB Design, Inc.              
[log in to unmask]
(407) 340-2668
www.saturnpcb.com


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Wednesday, January 29, 2014 4:17 PM
To: [log in to unmask]
Subject: [TN] Wire Bonding Spec?

newbie question:

Do any IPC publications discuss wire bonding?
What we are trying to do is similar to COB, but this is a new subject for us...

thanks,
Jack


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