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February 2014

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Subject:
From:
Kenneth Wood <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kenneth Wood <[log in to unmask]>
Date:
Wed, 5 Feb 2014 18:51:23 -0500
Content-Type:
text/plain
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text/plain (38 lines)
Jack,
Use ENEPIG surface finish. A bit pricey but pretty good for wire bonding.
Ken
_____________________________________
Kenneth J. Wood
Saturn PCB Design, Inc.              
[log in to unmask]
(407) 340-2668
www.saturnpcb.com


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Wednesday, January 29, 2014 4:17 PM
To: [log in to unmask]
Subject: [TN] Wire Bonding Spec?

newbie question:

Do any IPC publications discuss wire bonding?
What we are trying to do is similar to COB, but this is a new subject for
us...

thanks,
Jack


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