Hi All,

I'm new here to Technet so I'll ask you to be gentle, at least at first. 
We are manufacturing fine-line aluminum trace PCBs and our customers are 
mainly wirebonding chips directly on the aluminum and attaching 
components on selective copper pads. We are trying to find a more 
elegant way to achieve through-hole connectivity than our current method 
of filling vias with solder wick braid and aluminum solder paste. It 
works but it's "fugly". The aluminum is 30µm and the dielectric is 
typically 2.1mil. Any ideas would be greatly appreciated.

Paul Jackson
Omni Circuit Boards
(855) 798 9717
*w*ww.omnicircuitboards.com


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